Your Semiconductor Tariff Exposure, Quantified by HTS Code
Tariff rates, trade flow analysis, and corridor risk for ICs, memory, discrete semiconductors, and fab equipment.
Process equipment chassis, wafer handler enclosures, vacuum chamber housings, and RF generator frames face a Section 232 surcharge from every major source country, plus active AD/CVD orders against China, Korea, and Vietnam. TariffVault surfaces the combined burden across countries, regimes, and forward-looking risk in a single matrix.
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Semiconductor Sourcing Teams Face a Three-Front Tariff Problem
Trade policy, export controls, and supply chain concentration are reshaping semiconductor economics simultaneously
Section 301 on Chinese-Origin ICs
Section 301 List 3 tariffs apply to integrated circuits, memory chips, and packaged semiconductors from China. Fabless companies designing in the US but using Chinese OSAT for packaging and test pay the tariff on the finished part. Country of origin follows substantial transformation, not design location, and packaging is usually the step that fixes it.
Multi-Stage Tariff Stacking
A single chip can cross four borders before reaching your dock. Wafer fab in Taiwan, die prep in Japan, packaging in Malaysia, final test in China. Each stage carries different HTS classifications and tariff rates. Two identical dies from the same wafer can carry very different tariff rates based solely on where they were packaged.
New Fab Equipment Import Costs
CHIPS Act funding is driving new US fab construction, but the equipment to build those fabs is imported. EUV lithography systems from the Netherlands, silicon wafers from Japan and Germany, specialty chemicals from Korea, all carry import tariffs that CHIPS Act subsidies do not offset. Equipment under HTS 8486 faces rates that add millions to fab buildout budgets.
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Built for the Decisions Semiconductor Sourcing Teams Actually Make
OSAT Packaging, China vs Malaysia
Your fabless design uses a Chinese OSAT for packaging and test. The Section 301 tariff applies to the finished packaged IC, not the bare die. Moving to a Malaysian OSAT eliminates the tariff but changes freight, lead time, and qualification costs. The report shows the tariff rate on both origins. The modeler calculates the true landed cost delta. The atlas maps corridor risk for both supply chains.
Memory Sourcing, Korea vs China
Samsung and SK Hynix in Korea supply most DRAM and NAND globally, but Chinese memory producers are scaling domestic capacity. Korean-origin memory enters the US tariff-free under most classifications while Chinese-origin memory carries Section 301 tariffs. TariffVault compares the tariff treatment, trade flow volumes, and concentration risk side by side.
Fab Equipment Import for New US Fabs
You’re sourcing lithography, deposition, and etch equipment for a new US fab. ASML ships EUV systems from the Netherlands. Tokyo Electron ships from Japan. Even US-headquartered equipment makers manufacture some tools abroad. The report identifies the tariff rate per HTS code. The modeler quantifies total import tariff across your equipment bill of materials.
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See What Your HTS Code Actually Costs You
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Section 301 tariffs on Chinese semiconductors have been in force since 2019. Exclusion windows open and close. AD/CVD orders shift landed costs on specific product lines without notice.
Run Report
8542.31.0001
8542.32.0050
8541.49.0095
8486.20.0080
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